Home / Applications / Chip-On-Board (COB) Encapsulating – Glob Top and Dam & Fill/Frame & Fill Adhesives

Chip-On-Board (COB) Encapsulating – Glob Top and Dam & Fill/Frame & Fill Adhesives

Glob Top and Dam & Fill/Frame & Fill encapsulation provides protection for individual electronic components attached to PCB’s and FPC’s. Encapsulated components, (i.e. Flip-Chips, semiconductor die chips, delicate lead wires, etc.), are shielded from environmental stresses, contamination, and mechanical vibration. Tangent’s encapsulating materials serve to neutralize dissimilar Coefficient of Thermal Expansion (CTE) values between the component and board.

In addition, these materials improve individual component insulation, minimizing current loss.

Glob Top and Dam & Fill/Frame & Fill processes are integrated into automated assembly lines using programmable, robotic dispensing equipment. The encapsulating materials are deposited directly on the components and boards in precise, repeatable patterns.

Tangent Industries produces single component, light curable encapsulants with performance properties that are ideal for high volume production lines. The materials are highly resistant to contaminants, cure with minimal shrinkage, and remain extremely flexible to minimize risk of damage to fine wire leads and connections.

Tangent also offers encapsulants from Panacol-Elosol. Panacol-Elosol GmbH is part of the Hönle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years. Tangent is the exclusive distributor of Panacol’s products in the Americas. Light curable acrylates from Panacol are identified under the Vitralit® brand. Room temperature and thermal curing epoxies carry the Structalit® label. Structalit® epoxies are available as single or two component systems.

View the adhesive selections listed below for a possible candidate for your Glob Top and Dam & Fill/Frame & Fill application. Please contact Tangent to confirm your product selection and to secure additional application assistance, including samples and process recommendations. In the event that these standard products do not satisfactorily address your performance requirements, Tangent will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application.

Product Number Suitable Applications Viscosity cP mPa Shore Durometer 24 Hour Water Absorbtion LEDcure Bondable Substrates Comments/Features Request
TDS button TDS
Sample button Sample
90008 flex circuits/encapsulation 1000-2000 D40-50 < 2.0% no polyester, PVC, PC, Glass, metals UV/Visible cure, very flexible, tack free surface Request sample button TDS button
90013 encapsulation 900-1500 D35-50 < 1.0% yes plastics, ceramic, glass,stainless steel UV/Visible cure,flexible, self-leveling, tack-free surface Request sample button TDS button
90015 flex circuits/encapsulation 250-500 A45-65 < 1.0% yes plastics, ceramic, glass,stainless steel UV/Visible cure, soft, flexible, tack-free surface, very fast curing Request sample button TDS button
90086 flexcircuits/encapsulation/potting 500-800 A10-20 < 1.0% yes plastics, ceramic, glass,stainless steel UV/Visible cure, very soft, flexible Request sample button TDS button
90830 flex circuits/encapsulation 900-1500 A35-50 < 4.0% yes most plastics, ceramic, glass,stainless steel UV/Visible cure,soft, very flexible, tack free surface Request sample button TDS button
Structalit 5800 encapsulant/bonding 7000-15,000 D75-80 < 0.5% n/a glass,plastics,metal 2 component, 1:1 mix ratio, room temperature or 5 minute thermal cure ,low shrink, chemical resist Request sample button TDS button
Structalit 5890 glob top/encapsulant/dam material/ bonding 300k-400k D80-90 < 0.1% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component, 3 minute low-temp thermal cure, excellent thermally conductivity, black color Request sample button TDS button
Structalit 5891 glob top/encapsulant/dam material/ bonding 300,000-400,000 D80-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component, 3 minute low-temp thermal cure, quartz filled, excellent thermal shock resistance, black color Request sample button TDS button
Structalit 5894 encapsulant/bonding 45,000 – 55,000 D75-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component, thermal cure, impact resistant, black color Request sample button TDS button
Structalit 8801 potting/encapsulating 30,000-45,000 D80-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, thermal cure, chemical resistant, limited flow, max operating temperature up to 200°C, Max Temp up to 200°C Request sample button TDS button
Structalit 8804 potting/encapsulating 30,000-45,000 D80-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, thermal cure, chemical resistant, medium flow, grey color, max operating temperature up to 200°C, grey color, Max Temp up to 200°C Request sample button TDS button
Structalit 8805 potting/encapsulating 30,000-45,000 D80-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, thermal cure, chemical resistant, long flow for cavity filling, max operating temperature up to 200°C, grey color, Max Temp up to 200°C Request sample button TDS button
Structalit 8811 potting/encapsulating 30,000-45,000 D80-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, thermal cure, chemical resistant, limited flow, max operating temperature up to 200°C , black color, Max Temp up to 200°C Request sample button TDS button
Vitralit 1605 encapsulating 300-500 D80-90 < 0.2% yes, limited glass lens, metal, ceramic light curable, cationic epoxy, high optical clarity, low viscosity, easy to dispense, fast curing, high Tg, resistant to thermal cycling, no outgassing Request sample button TDS button
Vitralit 1650 glob top/encapsulant 6000-9000 D70-80 < 0.2% yes FR4 epoxy board, glass, metal, ceramic, plastics UV cure, cationic epoxy, high purity and low ionic content, high adhesion, resistant to thermal cycling, grey color Request sample button TDS button
Vitralit 1655 encapsulating 200-400 A70-80 < 0.35% no FR4 epoxy board, glass, metal, plastic UV cationic curable epoxy, clear and flexible , resistant to thermal shock, excellent for substrates with mismatched CTE, low viscosity, can be used as an underfill Request sample button TDS button
Vitralit 1657 glob top/encapsulant/flex circuit assembly 120,000-130,000 D62-68 < 0.8% no flex circuit film, FR4 epoxy board, glass, metal, ceramic, plastics UV cure, cationic epoxy, flexible, high purity and low ionic content, high adhesion, resistant to thermal cycling, light grey color Request sample button TDS button
Vitralit 1680 fill/encapsulate 6,000-9,000 D70-80 < 0.2% no FR4 epoxy board, glass, metal, ceramic, plastics, smart card UV cure, cationic epoxy, high purity and low ionic content, high adhesion, resistant to thermal cycling, grey color Request sample button TDS button
Vitralit 1688 fill/encapsulate 3,000-4,000 D70-80 < 0.2% no FR4 epoxy board, glass, metal, ceramic, plastics, smart card UV cure, cationic epoxy, high purity and low ionic content, high adhesion, resistant to thermal cycling, grey color Request sample button TDS button
Vitralit 6104-VT edge and corner bonding/encapsulating 75,000-90,000 D45-60 < 1.5% yes FR4 epoxy board, glass, metal,ceramic,plastics fast UV cure, secondary low-temp thermal cure, non-migrating, translucent Request sample button TDS button
Vitralit UD 5134 encapsulating/potting/component bonding 15,000-25,000 D70-85 < 0.2% yes FR4 epoxy board, glass, metal,ceramic,plastics extremely fast UV/Visible cure, secondary low-temp thermal cure, low CTE and shrink, tack-free surface, grey color Request sample button TDS button

*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Tangent Applications Engineering for viscosity ranges not shown in the table.
**Note: modifications can be made to most products in order to meet unique performance requirements. Adding fluorescing properties, color, and secondary curing mechanisms are typical examples of minor modifications. Please contact Tangent Applications Engineering to discuss your specific requirements.

Contact Tangent Industries for more info.