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Corner and Edge Bonding, Die Attachment, and Underfilling

Printed Circuit Board (PCB) and Flexible Printed Circuit (FPC) assembly processes are continuously changing to accommodate component modifications that increase speed and decrease package size. These changes have a direct impact on the adhesives used in component attachment. Adhesive manufacturers must constantly be in synch with new technology, and provide products that optimize manufacturing processes and the operating performance of the circuit.

Tangent offers a broad selection of adhesive products to address these challenges. They include light curable acrylics and cationic epoxies, as well as room temperature and thermal curing epoxies. Complete assembly solutions can be developed quickly from this diverse grouping.

Corner and edge bonding of BGA and similar surface mounted components is efficiently accomplished using Tangent’s selection of light curable adhesives. This grouping includes our exclusive LEDcure adhesive technology. LEDcure products from Tangent fully cure in seconds under low intensity UV/visible or Visible light. They are ideal for pairing with LED curing equipment. These high strength, flexible adhesives can minimize vibration and thermal interconnect stresses between the circuit board and BGA.

Die attachment and flip-chip underfilling adhesives are also available from Tangent. Light/thermal curable acrylates, cationic epoxies, and conductives deliver the properties demanded from these applications. These products are produced by Panacol-Elosol GmbH, and are identified under the Vitralit®, Elecolit®, and Structalit® brands. Panacol-Elosol GmbH is a member of the Hönle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years. Tangent is the exclusive distributor for these adhesives in the Americas.

All of our die attachment and underfilling adhesives can be dispensed manually or using automated dispensing systems. They are formulated to meet global regulatory standards, including RohS, REACH, UL, and IPC. The adhesives offer high resistance to thermal cycling and are made with low ionic content-less than 10 ppm. The consistent performance of this adhesive selection will reduce flip-chip thermal cycling stresses, ultimately increasing the fatigue life of the entire circuit assembly.

View the adhesive selections listed below for possible candidates for your corner bonding, edge bonding, die attachment, and underfilling applications. Please contact Tangent to confirm your product selection and to secure additional application assistance, including samples and process recommendations. In the event that these standard products do not satisfactorily address your performance requirements, Tangent will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application.

Product Number Suitable Applications Viscosity cP mPa Shore Durometer 24 Hour Water Absorbtion LEDcure Bondable Substrates Comments/Features Request
TDS button TDS
Sample button Sample
90070 edge bonding 8000-16,000 D70-80 < 3.0% yes FR4 epoxy board, stainless, plastics UV/Visible cure, hard, clear, very fast curing, tack-free Request sample button TDS button
Elecolit 3012 electrical conductivity/die attach/flip-chip bonding/antenna connection paste D82 n/a n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, 10 minute thermal cure, silver filled, excellent gap filling properties, dispenses well by valve or screen printing Request sample button TDS button
Elecolit 3024 electrical conductivity/die attach/flip-chip bonding/antenna connection 2800 D82 n/a n/a FR4 epoxy board, glass, metal, ceramic, plastics two component epoxy, quick low-temp or rapid high-temp snap cure, excellent for bonding heat sensitive components Request sample button TDS button
Elecolit 3025 electrical conductivity/die attach/flip-chip bonding/antenna connection paste (80,000-90,000) D70-80 < 0.5% n/a FR4 epoxy board, glass, metal, ceramic, plastics 2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates,good electrical conductivity, proven in automotive applications Request sample button TDS button
Elecolit 3036 electrical conductivity/die attach/flip-chip bonding/antenna connection paste (80,000-90,000) D70-80 < 0.5% n/a FR4 epoxy board, glass, metal, ceramic, plastics 2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates, medium level electrical conductivity Request sample button TDS button
Elecolit 3043 electrical conductivity/die attach/flip-chip bonding/antenna connection 4000-5000 D75-85 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, refrigerated storage, thermal cure, high purity and low ionic content, fine grade filler for easy dispensing and precise placement, excellent material for antenna printing Request sample button TDS button
Elecolit 3653 electrical conductivity/die attach/flip-chip bonding/antenna connection 8000-10,000 D60-75 < 0.3% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, refrigerated storage, fast thermal cure, flexible, vibration and impact resistant, easily dispensed Request sample button TDS button
Elecolit 3655 electrical conductivity/die attach/flip-chip bonding/antenna connection 150,000 – 450,000 D75-85 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics, semi-conductor highly filled material, excellent thermal conductivity, very good electrial conductivity, very small filler grain size, easy dispensable, high Tg and good resistnace after high curing temperature Request sample button TDS button
Elecolit 6207 thermal conductivity/component bonding 9,000-12,000 D76 < 0.3% n/a FR4 epoxy board, glass, metal, ceramic, plastics two part epoxy, room temperature curable, low shrinkage, UL 94 V0 approval, low viscostiy, good open time Request sample button TDS button
Elecolit 6601 thermal conductivity/component bonding 12,000-20,000 D80-90 < 0.3% n/a FR4 epoxy board, glass, metal,ceramic,plastics one component, refrigerated storage, excellent flow properties, heat curable, thermally conductive, white color, Max Temp up to 200°C Request sample button TDS button
Elecolit 6603 thermal conductivity/component bonding 95,000-115,000 D78-88 < 0.3% n/a FR4 epoxy board, glass, metal,ceramic,plastics one component, refrigerated storage, heat curable, slightly flexible, grey color, Max Temp up to 200°C Request sample button TDS button
Elecolit 6604 sensor bonding/ thermal conductivity 110,000-140,000 < 0.3% n/a metals, glass one component, thermal cure, refrigerated storage, good measured value transmission, low CTE, grey color, Max Temp up to 200°C Request sample button TDS button
Elecolit 6616 thermal conductivity/component bonding paste D81 n/a n/a FR4 epoxy board, glass, metal,ceramic,plastics two component, 1:1 mix ratio, scratch resistant, high peel strength, vibration and shock resistant, excellent stability during repeated thermal cycling (-50°C / +150°C) Request sample button TDS button
Structalit 5604 die attach 25,000-40,000 D80-90 n/a n/a FR4 epoxy board, glass, metal,ceramic,plastics Two minute thermal cure, withstands thermal shock, dispenses easily with industry-standard equipment, withstands soldering temperatures (270°C, max 5 minutes), red color Request sample button TDS button
Structalit 5800 encapsulant/bonding 7000-15,000 D75-80 < 0.5% n/a glass,plastics,metal 2 component, 1:1 mix ratio, room temperature or 5 minute thermal cure ,low shrink, chemical resist Request sample button TDS button
Structalit 5893 glob top/encapsulant/die attach/bonding 6000-10,000 D80-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component, 3 minute low-temp thermal cure, quartz filled, excellent thermal shock resistance, black color Request sample button TDS button
Structalit 5894 encapsulant/bonding 45,000 – 55,000 D75-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component, thermal cure, impact resistant, black color Request sample button TDS button
Vitralit 2113 encapsulating/potting/component bonding 19,000-32,000 D70-80 < 0.2% yes FR4 epoxy board, glass, metal,ceramic,plastics extremely fast UV/Visible cure, low CTE and shrink, tack-free surface, grey color Request sample button TDS button
Vitralit 5607 die attach 1000-2000 D75-90 n/a no FR4 epoxy board, glass, metal,ceramic,plastics UV cure, secondary thermal cure, acrylate base, red color, low shrink Request sample button TDS button
Vitralit 6104-VT edge and corner bonding/encapsulating 75,000-90,000 D45-60 < 1.5% yes FR4 epoxy board, glass, metal,ceramic,plastics fast UV cure, secondary low-temp thermal cure, non-migrating, translucent Request sample button TDS button
Vitralit 6129 thermal conductivity/component bonding 30,000-40,000 D65-75 <0.8% no FR4 epoxy board, glass, metal,ceramic,plastics multicure: UV light / thermal / activator, moisture resistant, low shrink, aluminum oxide filled, white color Request sample button TDS button
Vitralit 6137 thermal conductivity/component bonding 40,000-60,000 D55-56 n/a no FR4 epoxy board, glass, metal,ceramic,plastics UV cure, secondary thermal cure, flexible, white color, good chemical resistance, excellent thermal conductivity, Request sample button TDS button
Vitralit 6138 die attach with spacer and thermal conductivity 150-170 D55-65 n/a no FR4 epoxy board, glass, metal,ceramic,plastics UV cure, secondary thermal cure, flexible, white color, good chemical resistance, excellent thermal conductivity, creates consistent 40µm space between surfaces Request sample button TDS button
Vitralit UD 5134 encapsulating/potting/component bonding 15,000-25,000 D70-85 < 0.2% yes FR4 epoxy board, glass, metal,ceramic,plastics extremely fast UV/Visible cure, secondary low-temp thermal cure, low CTE and shrink, tack-free surface, grey color Request sample button TDS button

*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Tangent Applications Engineering for viscosity ranges not shown in the table.
**Note: modifications can be made to most products in order to meet unique performance requirements. Adding fluorescing properties, color, and secondary curing mechanisms are typical examples of minor modifications. Please contact Tangent Applications Engineering to discuss your specific requirements.

Contact Tangent Industries for more info.