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Electronic Component Potting

Electronic components inherently require protection from moisture and mechanical damage. For this reason, they are typically sealed with materials offering protective properties. These processes take place prior to next level of PCB assembly. Components such as capacitors, switches, and relays are typically designed with shallow cavities for containment, so that low viscosity potting materials may be dispensed quickly during automated production.

Tangent Industries offers single component, light curable potting materials that are specifically formulated to act as barriers against contamination, chemicals, moisture, and handling damage. These materials dispense easily, cure quickly, and provide a protective surface that is dry and tack-free. LEDcure adhesives are included in Tangent’s product selection for electronic component potting/encapsulating. LEDcure products from Tangent fully cure in fractions of a second under low intensity UV/visible or Visible light. They are ideal for use with LED light curing equipment.

Two additional brands of potting materials are offered by Tangent. They are Vitralit® light curable acrylates and epoxies, and Structalit® epoxies. Both are manufactured by Panacol-Elosol GmbH. Panacol-Elosol GmbH is a member of the Hönle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years. Tangent is the exclusive distributor for these adhesives in the Americas.

Tangent’s broad selection of potting materials bond to a variety of substrates including ABS, nylon, polycarbonate, and plated metals. Light curable materials are available with a secondary thermal cure catalyst in the event that shadowed areas exist in the potting field. Typical thermal curing schedules are identified on individual product technical data sheets.

View the adhesive selections listed below for a possible candidate for your potting application. Please contact Tangent to confirm your product selection and to secure additional application assistance, including samples and process recommendations. In the event that these standard products do not satisfactorily address your performance requirements, Tangent will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application.

Product Number Suitable Applications Viscosity cP mPa Shore Durometer 24 Hour Water Absorbtion LEDcure Bondable Substrates Comments/Features Request
TDS button TDS
Sample button Sample
90020 potting 1000-2000 A70-80 < 10% yes polyester, PVC, PC UV/Visible cure, resistant to thermal cycling/salt spray Request sample button TDS button
90046 potting/bonding 2000-3000 A60-70 < 1.0% yes plastics, ceramic, glass,stainless steel UV/Visible cure,soft, flexible, self-leveling, tack-free surface Request sample button TDS button
90075 potting 200-400 D80-90 < 1.0% yes PC, PVC, other plastics UV/Visible cure, very hard, fast flowing Request sample button TDS button
90086 flexcircuits/encapsulation/potting 500-800 A10-20 < 1.0% yes plastics, ceramic, glass,stainless steel UV/Visible cure, very soft, flexible Request sample button TDS button
Structalit 8801 potting/encapsulating 30,000-45,000 D80-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, thermal cure, chemical resistant, limited flow, max operating temperature up to 200°C, Max Temp up to 200°C Request sample button TDS button
Structalit 8804 potting/encapsulating 30,000-45,000 D80-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, thermal cure, chemical resistant, medium flow, grey color, max operating temperature up to 200°C, grey color, Max Temp up to 200°C Request sample button TDS button
Structalit 8805 potting/encapsulating 30,000-45,000 D80-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, thermal cure, chemical resistant, long flow for cavity filling, max operating temperature up to 200°C, grey color, Max Temp up to 200°C Request sample button TDS button
Structalit 8811 potting/encapsulating 30,000-45,000 D80-90 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, thermal cure, chemical resistant, limited flow, max operating temperature up to 200°C , black color, Max Temp up to 200°C Request sample button TDS button
Vitralit 2113 encapsulating/potting/component bonding 19,000-32,000 D70-80 < 0.2% yes FR4 epoxy board, glass, metal,ceramic,plastics extremely fast UV/Visible cure, low CTE and shrink, tack-free surface, grey color Request sample button TDS button
Vitralit UD 5134 encapsulating/potting/component bonding 15,000-25,000 D70-85 < 0.2% yes FR4 epoxy board, glass, metal,ceramic,plastics extremely fast UV/Visible cure, secondary low-temp thermal cure, low CTE and shrink, tack-free surface, grey color Request sample button TDS button

*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Tangent Applications Engineering for viscosity ranges not shown in the table.
**Note: modifications can be made to most products in order to meet unique performance requirements. Adding fluorescing properties, color, and secondary curing mechanisms are typical examples of minor modifications. Please contact Tangent Applications Engineering to discuss your specific requirements.

Contact Tangent Industries for more info.