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Electrically Conductive Adhesives

 

Tangent Industries offers electrically conductive adhesives for applications involving die bonding, underfilling, antennae printing, flip-chips, LCD, and flex circuit assembly.

As their exclusive distributor for the Americas, Tangent provides Elecolit® brand epoxies from Panacol-Elosol. Panacol-Elosol GmbH is a member of the Hönle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years.

In select applications, Elecolit® electrically conductive adhesives from Tangent can have significant advantages over traditional soldering methods. Some of their benefits include:

  • Connecting thermally sensitive components – curing occurs at low temperatures (<200°C)
  • Strain relief for electrical connections that experience significant stress during operation
  • Attaching components where connections are not accessible for soldering
  • Electrically conductive adhesives are solvent and lead-free
  • No cleaning or flux is required
  • Easily incorporated into existing assembly processes

Elecolit® electrically conductive adhesives include thermally curable one and two-component products as well as a UV light curable, anisotropic adhesive series. While single component adhesives simplify dispensing and processing, two-component adhesives provide longer shelf life and can be cured at room temperature. The range of adhesive compositions includes epoxies, acrylates, and polyamides. To facilitate practical conductivity, fillers such as palladium, gold, silver, copper, nickel, and graphite are used.

View the electrically conductive adhesive products listed below for a possible candidate for your application. Please contact Tangent to confirm your product selection and to secure additional application assistance, including samples and process recommendations. In the event that these standard products do not satisfactorily address your performance requirements, Tangent will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application.

Product Number Suitable Applications Viscosity cP mPa Shore Durometer 24 Hour Water Absorbtion LEDcure Bondable Substrates Comments/Features Request
TDS button TDS
Sample button Sample
Elecolit 3012 electrical conductivity/die attach/flip-chip bonding/antenna connection paste D82 n/a n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, 10 minute thermal cure, silver filled, excellent gap filling properties, dispenses well by valve or screen printing Request sample button TDS button
Elecolit 3024 electrical conductivity/die attach/flip-chip bonding/antenna connection 2800 D82 n/a n/a FR4 epoxy board, glass, metal, ceramic, plastics two component epoxy, quick low-temp or rapid high-temp snap cure, excellent for bonding heat sensitive components Request sample button TDS button
Elecolit 3025 electrical conductivity/die attach/flip-chip bonding/antenna connection paste (80,000-90,000) D70-80 < 0.5% n/a FR4 epoxy board, glass, metal, ceramic, plastics 2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates,good electrical conductivity, proven in automotive applications Request sample button TDS button
Elecolit 3036 electrical conductivity/die attach/flip-chip bonding/antenna connection paste (80,000-90,000) D70-80 < 0.5% n/a FR4 epoxy board, glass, metal, ceramic, plastics 2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates, medium level electrical conductivity Request sample button TDS button
Elecolit 3043 electrical conductivity/die attach/flip-chip bonding/antenna connection 4000-5000 D75-85 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, refrigerated storage, thermal cure, high purity and low ionic content, fine grade filler for easy dispensing and precise placement, excellent material for antenna printing Request sample button TDS button
Elecolit 3653 electrical conductivity/die attach/flip-chip bonding/antenna connection 8000-10,000 D60-75 < 0.3% n/a FR4 epoxy board, glass, metal, ceramic, plastics one component epoxy, refrigerated storage, fast thermal cure, flexible, vibration and impact resistant, easily dispensed Request sample button TDS button
Elecolit 3655 electrical conductivity/die attach/flip-chip bonding/antenna connection 150,000 – 450,000 D75-85 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics, semi-conductor highly filled material, excellent thermal conductivity, very good electrial conductivity, very small filler grain size, easy dispensable, high Tg and good resistnace after high curing temperature Request sample button TDS button

*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Tangent Applications Engineering for viscosity ranges not shown in the table.
**Note: modifications can be made to most products in order to meet unique performance requirements. Adding fluorescing properties, color, and secondary curing mechanisms are typical examples of minor modifications. Please contact Tangent Applications Engineering to discuss your specific requirements.

Contact Tangent Industries for more info.