Thermally Conductive Adhesives
The ability of an electronic or electrical component to dissipate heat has a direct impact on its reliability and longevity. Heat dissipation can be improved in many component assembly applications by incorporating thermally conductive adhesives as bonding agents. Thermally conductive adhesives will channel heat from the bonded component to the attached substrate that functions as a heat sink or dissipater. Electrically conductive materials with metallic fillers are excellent at conducting heat due to their metal content. However, this also creates electrical conductivity, which may or may not be desirable. If only thermal conductivity is needed, non-metallic filled products should be utilized.
As their exclusive distributor for the Americas, Tangent offers thermally conductive epoxies from Panacol-Elosol. Panacol-Elosol GmbH is a member of the Hönle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years.
View the thermally conductive products listed below for a possible candidate for your application. Please contact Tangent to confirm your product selection and to secure additional application assistance, including samples and process recommendations.
|Product Number||Suitable Applications||Viscosity cP mPa||Shore Durometer||24 Hour Water Absorbtion||LEDcure||Bondable Substrates||Comments/Features||Request
|electrical conductivity/die attach/flip-chip bonding/antenna connection||150,000 – 450,000||D75-85||< 0.2%||n/a||FR4 epoxy board, glass, metal, ceramic, plastics, semi-conductor||highly filled material, excellent thermal conductivity, very good electrial conductivity, very small filler grain size, easy dispensable, high Tg and good resistnace after high curing temperature|
|thermal conductivity/component bonding||9,000-12,000||D76||< 0.3%||n/a||FR4 epoxy board, glass, metal, ceramic, plastics||two part epoxy, room temperature curable, low shrinkage, UL 94 V0 approval, low viscostiy, good open time|
|thermal conductivity/component bonding||12,000-20,000||D80-90||< 0.3%||n/a||FR4 epoxy board, glass, metal,ceramic,plastics||one component, refrigerated storage, excellent flow properties, heat curable, thermally conductive, white color, Max Temp up to 200°C|
|thermal conductivity/component bonding||95,000-115,000||D78-88||< 0.3%||n/a||FR4 epoxy board, glass, metal,ceramic,plastics||one component, refrigerated storage, heat curable, slightly flexible, grey color, Max Temp up to 200°C|
|sensor bonding/ thermal conductivity||110,000-140,000||< 0.3%||n/a||metals, glass||one component, thermal cure, refrigerated storage, good measured value transmission, low CTE, grey color, Max Temp up to 200°C|
|thermal conductivity/component bonding||paste||D81||n/a||n/a||FR4 epoxy board, glass, metal,ceramic,plastics||two component, 1:1 mix ratio, scratch resistant, high peel strength, vibration and shock resistant, excellent stability during repeated thermal cycling (-50°C / +150°C)|
|glob top/dam material||250,000-300,000||D80-90||< 0.3%||no||FR4 epoxy board, glass, metal, ceramic, plastics||UV cure, cationic epoxy, good heat conductivity, moisture resistant, high purity and low ionic content, high adhesion, resistant to thermal cycling|
|thermal conductivity/component bonding||30,000-40,000||D65-75||<0.8%||no||FR4 epoxy board, glass, metal,ceramic,plastics||multicure: UV light / thermal / activator, moisture resistant, low shrink, aluminum oxide filled, white color|
|thermal conductivity/component bonding||40,000-60,000||D55-56||n/a||no||FR4 epoxy board, glass, metal,ceramic,plastics||UV cure, secondary thermal cure, flexible, white color, good chemical resistance, excellent thermal conductivity,|
|die attach with spacer and thermal conductivity||150-170||D55-65||n/a||no||FR4 epoxy board, glass, metal,ceramic,plastics||UV cure, secondary thermal cure, flexible, white color, good chemical resistance, excellent thermal conductivity, creates consistent 40µm space between surfaces|
*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Tangent Applications Engineering for viscosity ranges not shown in the table.
Contact Tangent Industries for more info.