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Thermally Conductive Adhesives

The ability of an electronic or electrical component to dissipate heat has a direct impact on its reliability and longevity. Heat dissipation can be improved in many component assembly applications by incorporating thermally conductive adhesives as bonding agents. Thermally conductive adhesives will channel heat from the bonded component to the attached substrate that functions as a heat sink or dissipater. Electrically conductive materials with metallic fillers are excellent at conducting heat due to their metal content. However, this also creates electrical conductivity, which may or may not be desirable. If only thermal conductivity is needed, non-metallic filled products should be utilized.

As their exclusive distributor for the Americas, Tangent offers thermally conductive epoxies from Panacol-Elosol. Panacol-Elosol GmbH is a member of the Hönle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years.

View the thermally conductive products listed below for a possible candidate for your application. Please contact Tangent to confirm your product selection and to secure additional application assistance, including samples and process recommendations.

Product Number Suitable Applications Viscosity cP mPa Shore Durometer 24 Hour Water Absorbtion LEDcure Bondable Substrates Comments/Features Request
TDS button TDS
Sample button Sample
Elecolit 3655 electrical conductivity/die attach/flip-chip bonding/antenna connection 150,000 – 450,000 D75-85 < 0.2% n/a FR4 epoxy board, glass, metal, ceramic, plastics, semi-conductor highly filled material, excellent thermal conductivity, very good electrial conductivity, very small filler grain size, easy dispensable, high Tg and good resistnace after high curing temperature Request sample button TDS button
Elecolit 6207 thermal conductivity/component bonding 9,000-12,000 D76 < 0.3% n/a FR4 epoxy board, glass, metal, ceramic, plastics two part epoxy, room temperature curable, low shrinkage, UL 94 V0 approval, low viscostiy, good open time Request sample button TDS button
Elecolit 6601 thermal conductivity/component bonding 12,000-20,000 D80-90 < 0.3% n/a FR4 epoxy board, glass, metal,ceramic,plastics one component, refrigerated storage, excellent flow properties, heat curable, thermally conductive, white color, Max Temp up to 200°C Request sample button TDS button
Elecolit 6603 thermal conductivity/component bonding 95,000-115,000 D78-88 < 0.3% n/a FR4 epoxy board, glass, metal,ceramic,plastics one component, refrigerated storage, heat curable, slightly flexible, grey color, Max Temp up to 200°C Request sample button TDS button
Elecolit 6604 sensor bonding/ thermal conductivity 110,000-140,000 < 0.3% n/a metals, glass one component, thermal cure, refrigerated storage, good measured value transmission, low CTE, grey color, Max Temp up to 200°C Request sample button TDS button
Elecolit 6616 thermal conductivity/component bonding paste D81 n/a n/a FR4 epoxy board, glass, metal,ceramic,plastics two component, 1:1 mix ratio, scratch resistant, high peel strength, vibration and shock resistant, excellent stability during repeated thermal cycling (-50°C / +150°C) Request sample button TDS button
Vitralit 1671 glob top/dam material 250,000-300,000 D80-90 < 0.3% no FR4 epoxy board, glass, metal, ceramic, plastics UV cure, cationic epoxy, good heat conductivity, moisture resistant, high purity and low ionic content, high adhesion, resistant to thermal cycling Request sample button TDS button
Vitralit 6129 thermal conductivity/component bonding 30,000-40,000 D65-75 <0.8% no FR4 epoxy board, glass, metal,ceramic,plastics multicure: UV light / thermal / activator, moisture resistant, low shrink, aluminum oxide filled, white color Request sample button TDS button
Vitralit 6137 thermal conductivity/component bonding 40,000-60,000 D55-56 n/a no FR4 epoxy board, glass, metal,ceramic,plastics UV cure, secondary thermal cure, flexible, white color, good chemical resistance, excellent thermal conductivity, Request sample button TDS button
Vitralit 6138 die attach with spacer and thermal conductivity 150-170 D55-65 n/a no FR4 epoxy board, glass, metal,ceramic,plastics UV cure, secondary thermal cure, flexible, white color, good chemical resistance, excellent thermal conductivity, creates consistent 40µm space between surfaces Request sample button TDS button

*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Tangent Applications Engineering for viscosity ranges not shown in the table.
**Note: modifications can be made to most products in order to meet unique performance requirements. Adding fluorescing properties, color, and secondary curing mechanisms are typical examples of minor modifications. Please contact Tangent Applications Engineering to discuss your specific requirements.

Contact Tangent Industries for more info.